As a technical manufacturer specializing in the printed circuit board& pcb assembly industry, Whether you need rigid pcb circuit boards, flexible PCB(FPC), rigid flex pcb circuits or aluminum clad pcb circuit boards, FZ PCB's manufacturing solutions can help.


Rigid PCB from Single-sided up to 16 layers (thickness 0.4mm Min., 3.2mm Max)
Flex/Flex-rigid pcb (up to 12 layers)
HF/Impedance-control (Polar)
HDI, Halogen-free pcb circuit boards
Copper up to 6 oz
RoHS/UL, ISO9001: 2000 & ISO/TS16949: 2002
IPC 6010, IPC6012, IPC6013 Class 1-3



FZ-PCB Company Profile

· Established in 2002
· Privately owned company
· 10, 700 Square feet Facility
· Nearly 600 Employees
· 21, 000 Square feet Monthly output
· Specialize in Prototypes to large batch production
· High technology multilayer PCBs
· HDI and Sequential Lamination
· Flexible, Flex-rigid and Rigid PCBs
· Turnover USD$16 Million (2012-2013)
· RoHS/UL, ISO9001: 2000 & ISO/TS16949: 2002

What will you get from FZ-PCB

· Reliable and stable quality with more than 12 years pcb manufacturing experience.
· Quick response & 24 hours available service.
· Professional sales service & advice.
· Fulfillment of our promises, NO lies.
· Protecting your Intellectual property. All our staff of trained professionals are · Working under a strict confidential contract.


PCBA Capabilities included
· Components procerement, PCB and accessories manufacturing, PCB Assembly, mechanical and final assembly, Electronic testing and function testing.
· High precision0402, 0603, 0805, 1210 and 2512; Fine pitch QFP(0.3mm), BGA(0.5mm), IC(0.3mm) bonding size components SMT technology and lead free RoHS technology.
· Circuit boards with 1 to 8 layers PCB layout, modification, fabrication, plastics, metal box building, final assembly and testing.
· ISO 9001-2000 certification and elevator safety report.
PCBA building experience range
· Industrial elevator system, digital video record (DVR) system, medical, computing, storage, instrumentation, traffic, industrial power, fire alarm, wireless communication, telecommunication, networking and house controller.


· Stencil size/range: 736*736mm
· Minimum IC pitch: 0.3mm (12mil)
· Foot Pin: SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
· Maximum PCB size: 410x600mm(16.2''*23.6'')
· Minimum PCB thickness: 0.35mm(13.8mil)
· Minimum chip size: 0201 (0.2x0.1mm)/0603 (0.6 x 0.3mm)
· Maximum BGA size: 74x74mm (2.9''*2.9'')
· BGA ball pitch: 1mm ~3mm (4mil~12mil)
· BGA ball diameter: 0.4mm~1mm (16mil~40mil)
· QFP lead pitch: 0.38mm ~ 2.54mm (15mil~100mil)
· Frequency of stencil cleaning: 1 time/5 to 10 pieces
· Package: Anti-static Bubble bag& Carton


Package & Shipping Method:

1. Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement

Payment method

1. T/T
2. Paypal
3. Western Union