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HTD Integrated Sensing Busbar
Basic Info
| Model No. | Battery System |
|---|---|
| Brand Name | HTD |
Product description
Product Positioning:
The HTD Integrated Sensing Busbar is an intelligent component within the battery module that achieves integrated current collection, voltage sampling, and temperature signal acquisition. By integrating Flexible Printed Circuits (FPC), copper/aluminum conductors, and insulation structures, it replaces traditional discrete wiring harnesses. It undertakes high-current busbar functions while simultaneously collecting cell voltage and temperature signals in real time and transmitting them to the Battery Management System (BMS). It is a key component for enhancing the intelligence, management precision, and safety of the battery pack.
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Key Performance Parameters of?Insert Molding：
| Category | Specific Parameters | Test Standard |
| Signal Acquisition Component | FPC/FFC flexible circuit (PCB optional), supports simultaneous voltage/temperature acquisition | IEC 60664-1 |
| Conductive Material | Aluminum busbar (AL1000 series) or copper-clad aluminum composite, Cu layer 30%-40% | ASTM B209 |
| Sampling Accuracy | Voltage sampling error ≤ ±1mV; Temperature sampling accuracy ±1% (NTC/PTC) | ISO 21782 |
| Insulation & Withstand Voltage | Insulation layer withstand voltage ≥2500V AC, Protection level IP67 | ISO 20653 |
| Integration Process | Laser welding (depth ≥0.5mm) or bolted connection (torque accuracy ±0.5N·m) | IEC 60947 |
| Insulation Treatment | Hot-pressed insulating film/Injection molded bracket/Vacuum formed spacer, customizable | UL 94 V-0 |
| Operating Temperature |
-40°C to +125°C (FPC component);
-40°C to +150°C (Aluminum busbar)
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GB/T 28046 |
| Lightweight Design |
Over 50% weight reduction and 60% volume reduction compared to traditional wiring harness solutions |
Real-vehicle validation |
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- FPC Micro-circuit Processing: Uses Roll-to-Roll (R2R) process with steps like exposure, etching, and gold plating to form precise sampling circuits; trace width accuracy ±0.05mm.
- Component Mounting: Utilizes Surface Mount Technology (SMT) to solder NTC temperature sensors and sampling resistors; solder paste viscosity controlled at 182-220 Pa·s to prevent bridging or insufficient solder.
- Protection Structure: Critical components are surrounded by FR4 frames with potting filler in avoidance grooves to enhance vibration resistance and short-circuit prevention.
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- Hot-press Lamination: Uses PET insulating film (upper acrylic foam + lower PET) laminated at 150°C, 1MPa to achieve fully sealed integration of FPC and aluminum busbar.
- Innovative Laser Welding: Pre-formed welding holes position nickel sheets for laser welding onto the aluminum busbar, avoiding damage to FPC copper foil; weld porosity < 25%.
| Step | Core Process | Key Technical Points | Output Standard |
| 1 | FPC Circuit Fabrication | R2R micro-etching, trace width/spacing accuracy ±0.05mm | Impedance consistency ≤ 3% |
| 2 | Component Mounting & Soldering | SMT + reflow soldering, NTC weld porosity < 5% | Sampling accuracy ±1% |
| 3 | Busbar & FPC Integration | Hot-press film lamination or injection molded bracket fixation | Insulation withstand voltage ≥2500V |
| 4 | Laser Welding & Inspection | Welding hole positioning for nickel sheets, X-Ray inspection of weld quality | False welding rate < 0.1% |
| 5 | Full Function Test | Continuity/Insulation withstand voltage/NTC temperature drift test, MES data traceability | Defect rate ≤ 0.1% |
HTD Integrated Sensing Busbar
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