Product description
Plastic molding and injection
Sheet metal stamping and punching
Painting lines
Die-casting lines
Powder coating lines
Silkscreen and pad printing
High-speed SMT and DIP assembly
Chip-on-board (COB)
Surface-mount technology (SMT)
Ball-grid array (BGA)
Through-hole
Profound knowledge of contract manufacturing services
Capable of developing effective production process to ensure high quality and consistency
Experienced logistics management
Cost-effective factory located in mainland China
Able to handle small as well as large volume production with flexibility