PCB Assembly with Functional Testing for Network Adapters
PCB Assembly with Functional Testing for Network Adapters
PCB Assembly with Functional Testing for Network Adapters
PCB Assembly with Functional Testing for Network Adapters
PCB Assembly with Functional Testing for Network Adapters

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PCB Assembly with Functional Testing for Network Adapters

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Basic Info

Model No. Topscom20140722002
Brand Name

Product description

  • Plastic molding and injection
  • Sheet metal stamping and punching
  • Painting lines
  • Die-casting lines
  • Powder coating lines
  • Silkscreen and pad printing
  • High-speed SMT and DIP assembly
  • Chip-on-board (COB)
  • Surface-mount technology (SMT)
  • Ball-grid array (BGA)
  • Through-hole
  • Profound knowledge of contract manufacturing services
  • Capable of developing effective production process to ensure high quality and consistency
  • Experienced logistics management
  • Cost-effective factory located in mainland China
  • Able to handle small as well as large volume production with flexibility
  • Topscom Precision Industry Co Limited
    • 12yrs
    Shenzhen, Guangdong, China
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    PCB Assembly with Functional Testing for Network Adapters

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