Wide-Format Shield for Multi-Module Layouts
Wide-Format Shield for Multi-Module Layouts

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Wide-Format Shield for Multi-Module Layouts

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Basic Info

Model No. H5-758222-04w
Brand Name Hesheng

Product description

Spacious EMI Protection for Complex Circuit Zones

The “Shielding case H5-758222-04w” is a wide-format Other Shielding solution engineered to cover expansive or multi-component areas on modern PCBs. With generous external dimensions of 35 mm (width) × 45 mm (length) and a height of 9 mm, it offers an internal clearance of approximately 8.2 mm—making it ideal for shielding clusters of ICs, RF modules, power regulators, and mixed-signal circuits. This design positions it as a strategic component within high-performance EMI Shielding Solutions, delivering comprehensive Protective Shielding for telecom infrastructure, automotive radar systems, industrial controllers, and advanced consumer electronics.

Core Specifications

  • Material: 0.35 mm tin-nickel alloy with low contact resistance
  • External Dimensions: 35 mm × 45 mm × 9 mm
  • Internal Clearance: ~8.2 mm—supports multi-device coverage in a single shield
  • Shielding Effectiveness: ≥75 dB from 100 MHz to 8 GHz
  • Flange Width: 1.8 mm with laser-trimmed edges for uniform grounding
  • Lid Type: Secure press-fit lid with perimeter grounding fingers
  • Compliance: RoHS 3, REACH, FCC Part 15 Class A/B, IEC 61000-4-3/6/8

Application Flexibility

Unlike narrow-profile shields, the H5-758222-04w addresses the growing need for area-efficient EMI containment over large functional blocks. Its wide footprint reduces the need for multiple smaller shields, simplifying layout, lowering assembly costs, and improving overall shielding continuity.

Ideal Use Cases

  • 5G mmWave front-end modules requiring unified Protective Shielding
  • Automotive ADAS control units integrated into robust EMI Shielding Solutions
  • Industrial PLCs with dense analog-digital circuitry
  • High-end audio interfaces sensitive to RF noise
  • Smart gateway devices combining Wi-Fi 6E, Bluetooth, and Zigbee radios

Frequently Asked Questions

Q: Can this shield be used in reflow soldering?
A: Yes—it’s designed for standard lead-free reflow profiles up to 260°C.

Q: Is the lid reusable after removal?
A: Yes—the press-fit mechanism allows for multiple removals without compromising RF integrity.

Q: Does it support thermal management?
A: While primarily for EMI control, optional vented lid versions are available for thermal-sensitive designs.

A Strategic Choice for Large-Scale EMI Control

As a premium Other Shielding option, the H5-758222-04w enables engineers to implement efficient, large-area Protective Shielding without sacrificing board real estate or performance. When deployed as part of holistic EMI Shielding Solutions, it ensures signal integrity across complex, multi-radio platforms—making it indispensable in next-generation electronic systems where interference mitigation is critical.

Wenzhou Hesheng Electronic Co., Ltd.
  • 2yrs
Wenzhou, Zhejiang, China
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Shielding case HS-758222-04W

  • Shielding case HS-758222-04W

  • Shielding case HS-758222-04W

Wide-Format Shield for Multi-Module Layouts

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