Ceramic substrates usually have excellent mechanical and heat resistance properties, but their electrical conductivity is poor. A metal conductive layer can be formed on the ceramic substrate by gold plating to achieve electrical connection.

 

Gold-plated ceramic substrates have high thermal conductivity and high bonding strength, which can effectively conduct the heat generated by the chip while ensuring a stable connection between the chip and the packaging material. It is often used in device packaging with high power, small size, high heat dissipation and precision wiring requirements. Such as lasers, lidars, LEDs and other high-power chip packaging.

 

The base material generally used for gold-plated ceramic substrates is an alumina substrate or an aluminum nitride substrate.