electronics component module PCB Fabrication with Immersion Gold

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electronics component module PCB Fabrication with Immersion Gold

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Basic Info

Model No.
Brand Name ckt

Product description

  • Specifications:
    • Base material: FR4
    • Layer count: 2
    • Board thickness: 1.00mm
    • Copper thickness: 1oz
    • Surface finish: immersion gold
    • Solder-mask color: green
    • Sizes: 99.03 x 61.96/1up
    • Base material: FR4, aluminum, FPC and copper
    • Copper thickness: 0.5oz (minimum)
    • Copper thickness: 4oz (maximum)
    • Board thickness: 0.2mm (minimum)
    • Board thickness: 3.2mm (maximum)
    • Surface finish: HAL, ENIG, OSP, gold finger and chemistry tin
    • Possible solder mask colors: green, black, white, yellow and blue
    • Board dimension: 600 x 1,000mm
    • Hole diameter: 0.2mm (minimum)
    • Line width: 0.075mm (minimum)
    • Line spacing: 0.075mm (minimum)
    • SMT pitch: 30 degrees (minimum)
    • Annular ring: 0.05mm (minimum)
    • Aspect ratio: 11:01
    • Surface/hole plating tolerance
    • Hole tolerance (PTH): 0.25mm
    • Hole tolerance (NPTH): 0.15mm
    • SM tolerance (LPI)
    • Dimension
    • Electrically test: supported
    • RoHS marks: supported
    • Possibility of SMT device mounting: supported
Cirket Electronics Company
  • 12yrs
Shenzhen, Guangdong, China
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electronics component module PCB Fabrication with Immersion Gold

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