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Basic Info
| Model No. | RFC-08 |
|---|---|
| Brand Name | hesheng |
Product description
Inside any reliable RF connector, the inner signal path plays a decisive role in transmission quality and long-term contact stability. This product focuses on the internal conductive structure and is suitable for routers, gateways, set-top boxes, and related communication equipment that requires accurate inner pin performance. As an important element among RF Connector Parts, it helps build a dependable 75 Ohm RF Interface and supports IEC-based connector structure requirements.
The assembly includes the key internal signal elements that connect the coaxial path from the external connector body to the internal circuit or cable system. This makes it especially valuable in designs where contact precision, conductivity, and plating quality are critical. Material choices generally include copper with tin plating or gold plating for the signal pin, along with compatible insulating components such as PA6T. When used together with a metal shell and frame, the product becomes a core part of a dependable Coaxial Socket Module for communication devices.
Technical performance remains aligned with the category parameters. It is suitable for 260℃ welding temperature conditions, contributes to 75 ohm impedance matching, and supports overall insertion loss of 3dB at 2.35GHz with return loss from -13 to -23dB over 100KHz to 2.35GHz when integrated properly into the connector system. These attributes make it highly relevant for search phrases such as precision coaxial signal pin assembly, gold plated rf contact module, and 75 ohm connector inner core.
From an SEO perspective, this inner contact product expands the coverage of RF Connector Parts beyond outer housings and frames. As part of a Coaxial Socket Module, it plays a direct role in maintaining signal continuity and contact reliability. For manufacturers or engineers seeking the critical conductive section of a 75 Ohm RF Interface, this precision pin assembly offers excellent value in terms of plating quality, signal function, and assembly compatibility.
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