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Semiconductor Laser Cladding System
Basic Info
Product description
Equipment parameters:
Main Machine Power: 2000W
Wavelength: 976
Focal Length:
Facula Size:
Laser Device Size:
Photoelectric Conversion: 55%
Density Ratios with Carbon Dioxide Laser Power: 2.5:1
Single cladding thickness: 0.1
Laser Device Weight:
Cooling Way: 1 P water-cooling
Cooling Medium: Deion water
Water Tank Size:
The machine size:
Control Device Size:
Numerical Control Machine Effective
X-axis=
Powder Feeder: Synchronous powder spraying Synchronous powder scattering
Semiconductor Laser Cladding System
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